Silicon Wafer Processing Equipment
Made In Taiwan
Specifications
12-inch Wafer Notch Grinder
System Specifications:
1. Power Voltage: 220V, 300W
2. Spindle: Water-cooled with water pump, speed: 0~24000 rpm
3. Transmission System: 3-axis ball screw with repeatability of ±0.03mm
4. Inverter: AC 220V, 2.2kW
5. Cooling System: Water-cooled
6. Control Method: CNC control, with a computer
7. Fixed Method: 12-inch wafer vacuum mount (8-inch wafer)
8. Feeding Method: Manual release
9. System Size: L900 × W700 × H520mm
10. System Weight: 50kg
12-inch Wafer Edge Grinder
System Specifications:
1. Power Voltage: 110V, 100W
2. Spindle: 3300~13000 rpm
3. Transmission System: 3-axis+A Axis ball screw with repeatability of ±0.03mm
4. Inverter: AC 110V
5. Cooling System: Water-cooled
6. Control Method: CNC control, with a computer
7. Fixed Method: 12-inch wafer vacuum mount (8-inch wafer vacuum mount optional)
8. Vacuum Turntable: AC 110V, 50W, 50~180 rpm
9. Feeding Method: Manual release and tools alignment
10. System Size: L450 × W450 × H700mm
11. System Weight: 50kg
12-inch Wafer Notch Polisher
System Specifications:
1. Power Voltage: 220V, 300W
2. Polisher Module: Polish wire system
3. Transmission System: 3-axis ball screw with repeatability of ±0.03mm
4. Inverter: AC 220V, 2.2kW
5. Cooling System: Water-cooled
6. Control Method: CNC control, with a computer
7. Fixed Method: 12-inch wafer vacuum mount (8-inch wafer vacuum mount optional)
8. Feeding Method: Manual release and tools alignment
9. System Size: L900 × W700 × H520mm
10. System Weight: 40kg