Silicon Wafer Processing Equipment

System Specifications:

1. Power Voltage: 220V, 300W

2. Spindle: Water-cooled with water pump, speed: 0~24000 rpm

3. Transmission System: 3-axis ball screw with repeatability of ±0.03mm

4. Inverter: AC 220V, 2.2kW

5. Cooling System: Water-cooled

6. Control Method: CNC control, with a computer

7. Fixed Method: 12-inch wafer vacuum mount (8-inch wafer)

8. Feeding Method: Manual release

9. System Size: L900 × W700 × H520mm

10. System Weight: 50kg

System Specifications:

1. Power Voltage: 110V, 100W

2. Spindle: 3300~13000 rpm

3. Transmission System: 3-axis+A Axis ball screw with repeatability of ±0.03mm

4. Inverter: AC 110V

5. Cooling System: Water-cooled

6. Control Method: CNC control, with a computer

7. Fixed Method: 12-inch wafer vacuum mount (8-inch wafer vacuum mount optional)

8. Vacuum Turntable: AC 110V, 50W, 50~180 rpm

9. Feeding Method: Manual release and tools alignment

10. System Size: L450 × W450 × H700mm

11. System Weight: 50kg

System Specifications:

1. Power Voltage: 220V, 300W

2. Polisher Module: Polish wire system

3. Transmission System: 3-axis ball screw with repeatability of ±0.03mm

4. Inverter: AC 220V, 2.2kW

5. Cooling System: Water-cooled

6. Control Method: CNC control, with a computer

7. Fixed Method: 12-inch wafer vacuum mount (8-inch wafer vacuum mount optional)

8. Feeding Method: Manual release and tools alignment

9. System Size: L900 × W700 × H520mm

10. System Weight: 40kg